JPS5777511U - - Google Patents
Info
- Publication number
- JPS5777511U JPS5777511U JP15559980U JP15559980U JPS5777511U JP S5777511 U JPS5777511 U JP S5777511U JP 15559980 U JP15559980 U JP 15559980U JP 15559980 U JP15559980 U JP 15559980U JP S5777511 U JPS5777511 U JP S5777511U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paper (AREA)
- Building Environments (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15559980U JPS6139555Y2 (en]) | 1980-10-30 | 1980-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15559980U JPS6139555Y2 (en]) | 1980-10-30 | 1980-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5777511U true JPS5777511U (en]) | 1982-05-13 |
| JPS6139555Y2 JPS6139555Y2 (en]) | 1986-11-13 |
Family
ID=29514781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15559980U Expired JPS6139555Y2 (en]) | 1980-10-30 | 1980-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6139555Y2 (en]) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100379089B1 (ko) | 1999-10-15 | 2003-04-08 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지 |
| US6905914B1 (en) | 2002-11-08 | 2005-06-14 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8324511B1 (en) | 2010-04-06 | 2012-12-04 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US8440554B1 (en) | 2010-08-02 | 2013-05-14 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US8552548B1 (en) | 2011-11-29 | 2013-10-08 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
-
1980
- 1980-10-30 JP JP15559980U patent/JPS6139555Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6139555Y2 (en]) | 1986-11-13 |